Process of fabricating complementary inverter circuit having mul

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257371, 257384, 257754, 257770, 437 34, 437 56, 437200, 437193, 148DIG19, 148DIG147, H01L 2170

Patent

active

054181798

ABSTRACT:
An integrated circuit is fabricated on a semiconductor substrate and comprises an n channel type field effect transistor, a p channel type field effect transistor and an interconnection coupled between the drain regions of the two field effect transistors, and each of the gate electrodes and the interconnection is provided with a polycrystalline silicon and a refractory metal silicide deposited over the polycrystalline silicon, wherein side spacers are eliminated from the gate electrodes and the interconnection, because no short circuiting takes place between the gate electrodes and the source and drain regions by virtue of the deposition of the refractory metal silicide.

REFERENCES:
patent: 4374700 (1983-02-01), Scott et al.
patent: 4682403 (1987-07-01), Hartmann et al.
patent: 4804636 (1989-02-01), Groover, III et al.
patent: 4873204 (1989-10-01), Wong et al.
patent: 4890141 (1989-12-01), Tang et al.
patent: 4929992 (1990-05-01), Thomas et al.
patent: 4939154 (1990-07-01), Shimbo
patent: 4939567 (1990-07-01), Kenney
patent: 5010032 (1991-04-01), Tang et al.
patent: 5066995 (1991-11-01), Young et al.
patent: 5086006 (1992-02-01), Asahina
patent: 5089429 (1992-02-01), Hsu
patent: 5093276 (1992-03-01), Asahina
patent: 5124280 (1992-06-01), Wei et al.
patent: 5134085 (1992-07-01), Gilgen et al.
patent: 5154946 (1992-10-01), Zdebel
patent: 5173450 (1992-12-01), Wei
patent: 5190886 (1993-03-01), Asahina
patent: 5190893 (1993-03-01), Jones, Jr. et al.
patent: 5298782 (1994-03-01), Sundaresan
patent: 5302539 (1994-04-01), Haken et al.
patent: 5304502 (1994-04-01), Hanagasaki
patent: 5318924 (1994-06-01), Lin et al.
patent: 5338701 (1994-08-01), Hsu et al.
patent: 5366928 (1994-11-01), Wolters et al.
Lai et al., "Design and Characteristics of a Lightly Doped Drain (LDD) Device Fabricated with Self-Aligned Titanium Disilicide" IEEE Transactions on Electron Devices, vol. ED-33, No. 3, Mar. 1986, pp. 345-353.
Tang et al., "VLSI Local Interconnect Level Using Titanium Nitride" IEDM 1985, pp. 590-593.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process of fabricating complementary inverter circuit having mul does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of fabricating complementary inverter circuit having mul, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of fabricating complementary inverter circuit having mul will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2140192

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.