Process of fabricating a circuit element for transmitting microw

Details Process of fabricating a circuit element for transmitting microw Process of fabricating a circuit element for transmitting microw

1995-05-24

1996-08-27

Tsai, H. Jey

Fishing, trapping, and vermin destroying

437184, 437912, H01L 21265

Patent

active

055500684

ABSTRACT:
A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower circuit resistance and lower parasitic interactions; an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyimide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

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Japanese Abstract, vol. 12, No. 55 (M669) (2902) published Feb. 19, 1988.

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