Process of electroplating porous substrates

Chemistry: electrical and wave energy – Processes and products

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204277, C25D 700, C25D 704

Patent

active

040453030

ABSTRACT:
A method of electroplating porous substrates includes the steps of disposing a porous substrate to be electroplated in an electrolyte solution, disposing an anode in the solution spaced apart from the substrate, with the anode being composed of the material to be deposited on the substrate, applying a gas to the substrate to flow therethrough, and applying a positive voltage to the anode and a negative voltage to the substrate while gas is flowing through the substrate.

REFERENCES:
patent: 3480530 (1969-11-01), Voorhies
patent: 3616286 (1971-10-01), Aylward et al.
patent: 3694325 (1972-09-01), Katz et al.

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