Process of ejecting an encapsulated semiconductor device from a

Details Process of ejecting an encapsulated semiconductor device from a Process of ejecting an encapsulated semiconductor device from a

1994-02-08

1995-09-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 26427215, 26427217, 264334, H01L 2156, H01L 21603, B29C 4502

Patent

active

054478880

ABSTRACT:
A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.

REFERENCES:
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5133921 (1992-07-01), Yokoyama

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