Process of deposition and solid state reaction for making alloye

Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...

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148537, 420469, C22C 900

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active

053305922

ABSTRACT:
The present invention relates to novel compounds that exhibit unusually low electrical resistivity at room temperature. More specifically, it has been discovered that the incorporation of at least 1 to 15 atomic percent of gallium and/or at least 1 to 15 atomic percent gold into stoichiometric copper germanide (Cu.sub.3 Ge) compound results in a room temperature resistivity comparable to elemental copper, but with superior chemical and electronic stability upon exposure to air or oxygen at high temperatures. Furthermore, the compounds of the present invention have none of the problems associated with the diffusion of copper into elemental and compound semiconductors which oftentimes lead to the degradation of the semiconductor device characteristics. Additionally, the present invention relates to a method of preparing the novel compounds mentioned previously hereinabove.

REFERENCES:
patent: 3158504 (1964-11-01), Anderson
patent: 3198999 (1965-08-01), Baker et al.
patent: 3243324 (1966-03-01), Kodera et al.
patent: 4201601 (1980-05-01), D'Silva
patent: 4853184 (1989-08-01), Naya et al.
patent: 5066612 (1991-11-01), Ohba et al.
patent: 5073210 (1991-12-01), Humpston et al.
patent: 5112699 (1992-05-01), Chang
patent: 5130274 (1992-07-01), Harper et al.
Krusin-Elbaum et al., "Usually low resistivity of copper germanide thin films formed at lo2 temperatures", Appl. Phys. Lett. 58, pp. 1341-1343 (1991).
Chang, "Thermal stability of the Cu/PtSi metallurgy", J. Appl. Phys. 66, pp. 2989-2992 (1989).
Chang, "Formation of copper silicides from Cu(100)Si(100) and Cu(111)/Si(111) structures", J. Appl. Phys. 67, pp. 566-568 (1990).
Cros, et al., "Formation, oxidation, electronic, and electrical properties of copper silicides", J. Appl. Phys. 67, pp. 3328-3336 (1990).

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