Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Patent
1998-06-10
2000-10-03
Wyszomierski, George
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
148536, 148679, 205157, 205224, C25D 550
Patent
active
061267619
ABSTRACT:
A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The film is heated in a temperature range of 70-100.degree. C. for at least five minutes, wherein the fine-grained microstructure is converted into a stable large-grained microstructure. In another embodiment, the plated film is stored, after the step of depositing, at a temperature not greater than -20.degree. C., wherein the fine-grained microstructure is stabilized without grain growth for the entire storage period.
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DeHaven Patrick W.
Goldsmith Charles C.
Hurd, deceased Jeffrey L.
Kaja Suryanarayana
Legere Michele S.
International Business Machines - Corporation
Townsend Tiffany L.
Wyszomierski George
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