Process of coating printed wiring board with solid solder resist

Details Process of coating printed wiring board with solid solder resist Process of coating printed wiring board with solid solder resist

1993-09-27

1994-06-28

Beck, Shrive

Coating processes

Electrical product produced

Photoelectric

427 77, 427259, 427264, 427265, 427272, 427282, 4273855, 427402, B05D 512

Patent

active

053245350

ABSTRACT:
A printed wiring board is selectively covered with solid solder resist pattern implemented by a first solder resist sub-pattern formed from liquid photo-sensitive solder resist and a second solder resist sub-pattern formed from photo-sensitive fry films, and a first area with pads and a second area with a through-hole or via-hole are respectively covered with the first solder resist sub-pattern and the second solder resist sub-pattern so that any peeling of the first solder resist sub-pattern and any residue of the liquid photo-sensitive solder resist in the through-hole or via-hole never take place.

REFERENCES:
patent: 4447519 (1984-05-01), Pritikin
patent: 4668332 (1987-05-01), Ohnuki et al.
patent: 4804615 (1989-02-01), Larson et al.

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