Process of chemical-mechanical polishing and manufacturing an in

Details Process of chemical-mechanical polishing and manufacturing an in Process of chemical-mechanical polishing and manufacturing an in

1998-08-18

2000-06-27

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, 438693, H01L 21302

Patent

active

060806710

ABSTRACT:
A polishing process to planarize a layer formed on a substrate and to reduce the variations in the thickness of that layer from substrate to substrate. The polishing process is implemented by polishing a substrate using a stable pad material. A stable pad material is formed from a polishing material that has substantially the same or similar density, hardness, and compressibility as polyurethane but is a material other than or substantially other than polyurethane. In an alternative embodiment, the material for the polishing pad may be selected for its compression, high tensile strength, wear resistance and/or resistance to water, diluted acids, and alkalis. In a further alternative embodiment, the material forming the polishing pad may be selected from the group comprising hydrogenated nitrile compounds, fluoroelastomers, or perfluoroelastomers.

REFERENCES:
patent: 4770927 (1988-09-01), Effenberger et al.
patent: 5039754 (1991-08-01), Sanchez
patent: 5198280 (1993-03-01), Harpell et al.
patent: 5230937 (1993-07-01), Effenberger et al.
patent: 5264290 (1993-11-01), Touchet et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5624303 (1997-04-01), Robinson
patent: 5733176 (1998-03-01), Robinson et al.
patent: 5823855 (1998-10-01), Robinson
patent: 5921855 (1999-07-01), Osterheld et al.

Affiliated with

Also associated with

Rating

Process of chemical-mechanical polishing and manufacturing an in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of chemical-mechanical polishing and manufacturing an in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of chemical-mechanical polishing and manufacturing an in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1784587