Metal fusion bonding – Process – Diffusion type
Patent
1997-09-02
2000-07-18
Heinrich, Samuel M.
Metal fusion bonding
Process
Diffusion type
228198, 2281241, 2282626, 428547, 428550, 428610, B05D 700
Patent
active
06089444&
ABSTRACT:
Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.
REFERENCES:
patent: 4886709 (1989-12-01), Sasame et al.
patent: 5126102 (1992-06-01), Takahashi et al.
patent: 5705283 (1998-01-01), Upadhya
Davis John W.
Driemeyer Daniel E.
Slattery Kevin T.
Elve M. Alexandra
Heinrich Samuel M.
Hoch Ramon R.
McDonnell Douglas Corporation
Westerlund Robert A.
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