Process in the production of a multilayer printed board

Details Process in the production of a multilayer printed board Process in the production of a multilayer printed board

1976-08-09

1978-02-28

Kendall, Ralph S.

Metal working

Method of mechanical manufacture

Electrical device making

156656, 156659, 156902, 156151, 156253, 204 15, 427 96, 427 97, H05K 306, H05K 336

Patent

active

040757579

ABSTRACT:
In a process for the production of a multilayer printed board built up by starting from a desired number of insulating bases clad on both sides with an unpatterned metal layer, the improvement consisting in that the metal layers, whereout conductive patterns are to be etched and which layers are to be hidden inside the finished multilayer printed board, are coated with a plating resist in the shape of a negative of the desired conductive pattern, that the remaining visible parts of the metal layers, which are to form the conductive patterns, are coated by electroplating with a thin, rough, adhesion-promoting metal layer comprising copper, zinc, nickel, tin or any one of their alloys, that an etch resist layer of nickel, tin or any one of their alloys is electroplated on top of the adhesion-promoting layer, if the latter consists of copper, zinc or any one of their alloys, that the negative plating resist is removed, that the parts of the metal layers thus uncovered are etched away and that the insulating bases provided with conductive patterns are laminated to a multilayer printed board.

REFERENCES:
patent: 3075866 (1963-01-01), Balser
patent: 3306830 (1967-02-01), Bittrich
patent: 3508330 (1970-04-01), Kubik
patent: 3654097 (1972-04-01), Degnan
patent: 3901770 (1975-08-01), Littwin

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