Process for working a semiconductor wafer

Details Process for working a semiconductor wafer Process for working a semiconductor wafer

1992-01-06

1998-02-03

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156248, 156268, 1562757, B32B 3118, B32B 3122, B32B 3128

Patent

active

057140294

ABSTRACT:
A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.

REFERENCES:
patent: 4286047 (1981-08-01), Bennett et al.
patent: 4312916 (1982-01-01), Kakumaru et al.
patent: 4379201 (1983-04-01), Heilmann et al.
English Translation of Claim of JP-B2-58-50164.
English Translation of Claim of JP-A-59-21038.

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