Process for wet chemical metallization of a substrate

Details Process for wet chemical metallization of a substrate Process for wet chemical metallization of a substrate

1989-04-24

1990-12-04

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 371, 204 384, C25D 554, C25D 1502

Patent

active

049751603

ABSTRACT:
A process for wet chemical metallization of a substrate includes the steps of cleansing the substrate to be metalized; precipitating an electrically highly conductive gas and vapor permeable metal base layer onto the cleansed substrate from a wet chemical metallization bath; precipitating a metal layer which is comprised of at least one metal and at least one kind of non-metallic particles onto the metal base layer by electrolytic deposition from a bath comprised of at least one electrolyte; and at least one kind of finely dispersed non-metallic particles and subjecting the metallized substrate to at least one heat treatment whereby volatile components embedded in the metal base layer and the metal layer are removed and the volume of the non-metallic particles in the metal layer is reduced. In a preferred embodiment the metal layer is comprised of copper and about 5 percent by weight of ceramic particles having a diameter of less than 10 .mu.m.

REFERENCES:
patent: 3147547 (1964-09-01), Kuebrich et al.
patent: 3687824 (1972-08-01), Brown
patent: 3723078 (1973-03-01), Parker
patent: 3753816 (1973-09-01), Feldstein et al.
patent: 3767538 (1973-10-01), Politycki et al.
patent: 4160707 (1979-07-01), Helle et al.
patent: 4285782 (1981-08-01), Waldrop et al.
patent: 4358922 (1983-11-01), Feldstein
IBM Technical Disclosure Bulletin, vol. 20, No. 8, Jan., 1978, p. 3079.

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