Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1994-04-22
1996-05-28
Bradley, P. Austin
Metal fusion bonding
Process
With condition responsive, program, or timing control
228219, 228232, 228260, B23K 3538, H05K 334
Patent
active
055203205
ABSTRACT:
The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, the inert gas atmosphere having a temperature which might be controlled. Particularly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). Also, maintaining the atmosphere under forced laminer flow conditions improves the quality of the solder joints. The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.
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Connors Robert W.
McKean Kevin
Rotman Frederic
Air Liquide America Corporation
Bradley P. Austin
Knapp Jeffrey T.
L'Air Liquide Societe Anonyme pour L'Etude et L'Exploitation des
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