Process for wave soldering

Details Process for wave soldering Process for wave soldering

1984-12-18

1986-09-09

Lin, Kuang Y.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

2281801, 228 37, B23K 108, B23K 3102

Patent

active

046103910

ABSTRACT:
In a process for wave soldering a work-piece in an atmosphere consisting essentially of air wherein (i) there is a first portion of the solder wave in which fluid motion can be observed, said first portion including an active dross forming area and (ii) there is a second portion of the solder wave, which is the last portion of the solder wave with which the work-piece comes into contact, the improvement comprising (a) subject to step (b), replacing the atmosphere in contact with at least about 50 percent of the surface of the active dross forming area with an inert gas; and (b) preventing the atmosphere in contact with the surface of the second portion from becoming inert regardless of whether the first and second portions overlap.

REFERENCES:
patent: 3445919 (1969-05-01), Saba
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3726007 (1973-04-01), Keller
patent: 3726465 (1973-04-01), Boynton et al.
patent: 3765591 (1973-10-01), Cook
patent: 3874068 (1975-04-01), Cook
patent: 4401253 (1983-08-01), O'Rourke
patent: 4402448 (1983-09-01), O'Rourke
patent: 4463891 (1984-08-01), Scheible et al.
Wassink, Electrochemical Publications Ltd., Ayr, Scotland, 1984, pp. 332 to 361.

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