Process for wafer thinning

Details Process for wafer thinning Process for wafer thinning

2008-05-13

2008-05-13

Sarkar, Asok K. (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S462000, C438S465000, C257SE21214, C257SE21237

Reexamination Certificate

active

07371664

ABSTRACT:
The present invention relates to a process for thinning a semiconductor wafer. Two surfaces of the wafer separately form a surface-bond glue (layer) and a surface protective glue (layer). The thinning process is applied to the wafer before forming the surface protective glue. Once the baking and drying process is applied to the surface-bond glue and the surface protective glue it then cuts the wafer. Finally, it dissolves the lower solubility of the surface protective glue to obtain the finished goods. The necessity of the selection of the wafer may serve to maintain quality standards. The wafer thinning process of the present invention is suitable for the extremely thin wafer. Thus, it reduces the production cost.

REFERENCES:
patent: 2002/0048904 (2002-04-01), Oka
patent: 2002/0187593 (2002-12-01), Walker et al.
patent: 2004/0092108 (2004-05-01), Yajima et al.
patent: 2006/0057836 (2006-03-01), Nagarajan et al.

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