Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1989-04-27
1990-12-11
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156249, 427 96, 427259, 428901, B44C 117
Patent
active
049768131
ABSTRACT:
This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.
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Handbook of Printed Circuit Manufacturing, Raymond H. Clark, pp. 240-244.
Salensky George A.
Thoman Thomas S.
Amoco Corporation
Engel, Jr. James J.
Simmons David
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