Process for treatment of materials with diode radiation

Electric heating – Metal heating – By arc

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Details

21912164, 21912166, 21912169, 21912172, 21912176, 21912183, 21912185, 148512, 148565, B23K 2600

Patent

active

057057885

DESCRIPTION:

BRIEF SUMMARY
CROSS REFERENCE TO RELATED APPLICATIONS

This application is a national phase of PCT/EP94/00706 filed 8 Mar. 1994 and based, in turn, on German national application P4316829.9 of 19 May 1993 under the International Convention.


FIELD OF THE INVENTION

The invention relates to a process for treatment of materials with diode radiation, especially laser diode radiation, in which the workpiece is welded, cut, bored, soldered and heat-treated, in each case considering the material of the workpiece.


BACKGROUND OF THE INVENTION

It is generally known to carry out treatment of materials with laser radiation. The laser radiation is generated by CO.sub.2 -eximer or Nd--YAG lasers which can achieve the requisite intensities of more than 10.sup.3 watt/cm. It is a disadvantage, however, that the efficiency is low, <10%, and on average the life of the laser system has a limited duration of about 10000 hours. Furthermore, the high thermal and mechanical sensitivity of the laser and the cost-intensive and labor-intensive maintenance associated therewith is disadvantageous. Cooling costs, power distribution cost and space for the set-up of the laser system are comparatively large.
The radiation profile of the laser beam is predetermined by the resonator of the laser. It can be changed by focusing optics, cylindrical mirrors, parabolic mirrors, facetted mirrors and integrators. The changes are, however, time-consuming and expensive.
A change in the radiation profile during the material treatment and especially in view of the respective treatment results, has been not possible heretofore.


OBJECT OF THE INVENTION

The invention has as its object a process for treatment of a material with diode radiation, especially laser diode radiation, such that matching of the radiation profile is possible without problems during the material treatment.


SUMMARY OF THE INVENTION

This object is achieved in that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile on the treatment region of the workpiece and a variation of the intensity distribution of the radiation profile is effected by control of the diode output power.
More particularly, the object of the invention is attained by controlling intensity distribution in the radiation profile by controlling the diode output power.
For the invention, therefore, it is initially of significance that diode radiation is used to carry out the treatment of the material which derives from a multiplicity of diodes. The radiation components of the total radiation used for the treatment is thus influenced by providing the diodes or groups of diodes in diode units so that they are respectively controlled. The control affects the diode output power and thus the intensity of the radiation and also its distribution on the workpiece. The control can be effected with very short response times, for example, less than a millisecond. As a consequence, the change in the intensity distribution of the radiation profile can be effected on-line during the process. By comparison to conventional lasers, therefore an important possibility is opened by the invention, namely, that of matching the radiation profile and particularly the intensity distribution to the workpiece in accordance with the requirements of the treatment process.
For the invention it is primarily of significance that diode radiation is used for the material treatment which derives from a multiplicity of diodes. The radiation contributions to the diode radiation used for the treatment can be influenced in that the diode or a plurality of diodes forming diode units can be controlled. The control can influence the diode output powers and thus the intensity of the radiation and also its distribution upon the workpiece. The control can be effected in very short periods, especially in less than a millisecond. As a consequence, the change in the intensity distribution of the radiation profile can be effected during the process or on line. As a consequence, by comparison to conventional lasers, the inv

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patent: 4963714 (1990-10-01), Adamski et al.
patent: 5553629 (1996-09-01), Keipert et al.

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