Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...
Patent
1990-02-28
1992-03-17
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly single metal or alloy substrate of...
205177, C25D 706
Patent
active
050965468
ABSTRACT:
The present invention relates to a process for treating a surface of a copper foil for producing the copper foil for a printed circuit board in which a zinc layer, a copper layer and a chromate layer are formed in turn on the copper foil. The product of the present invention is excellent in heat resistance and hydrochloric acid resistance and the process according to the present invention does not require the use of dangerous chemicals and is free from any problems on safety.
REFERENCES:
patent: 3585010 (1971-06-01), Luce et al.
patent: 4456508 (1984-06-01), Torday
patent: 4469567 (1984-09-01), Torday
Fujiki Makoto
Kitamura Nobuo
Kodama Yukio
Yoshimura Katsuhiro
Mitsui Kinzoku Kogyo Kabushiki Kaisha
Tufariello T. M.
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