Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate
2007-10-30
2007-10-30
Pizarro, Marcos D. (Department: 2814)
Semiconductor device manufacturing: process
Repair or restoration
C438S974000, C257SE21214
Reexamination Certificate
active
11348502
ABSTRACT:
A process for treating substrates for the microelectronics or optoelectronics industry, wherein the substrates include on at least one of their faces a working layer in which components are intended to be formed. The process includes a step of annealing under a reductive atmosphere followed by a step of chemical-mechanical polishing on the free surface of the working layer.
REFERENCES:
patent: 5374564 (1994-12-01), Bruel
patent: 5589422 (1996-12-01), Bhat
patent: 6020252 (2000-02-01), Aspar et al.
patent: 6287941 (2001-09-01), Kang et al.
patent: 6403450 (2002-06-01), Maleville et al.
patent: 6429104 (2002-08-01), Auberton-Herve
patent: 6531416 (2003-03-01), Kobayashi et al.
patent: 2002/0173872 (2002-11-01), Malik
patent: 197 53 494 (1998-10-01), None
patent: 0 553 852 (1993-08-01), None
patent: 0 917 188 (1999-05-01), None
patent: 0 917 193 (1999-05-01), None
patent: 2 681 472 (1993-03-01), None
patent: 2 748 851 (1997-11-01), None
patent: 2 761 526 (1998-10-01), None
patent: 2 762 136 (1998-10-01), None
patent: 2 774 510 (1999-08-01), None
patent: 2 777 115 (1999-10-01), None
patent: 5-102112 (1993-04-01), None
patent: 5-217821 (1993-08-01), None
patent: 10-242154 (1998-09-01), None
Sorab K. Ghandhi, VLSI Fabrication Principles: Silicon and Gallium Arsenide, Second Edition, John Wiley & Sons, Inc., New York, p. 726 (1994).
Maszara et al., “Quality of SOI film after surface smoothing with hydrogen annealing, touch-polishing,” Proceedings 1997 IEEE International SOI Conference, Oct. 1997, pp. 130-131.
Moriceau et al., “Hydrogen annealing treatment used to obtain high quality SOI surfaces,” Proceedings 1998 IEEE International SOI Conference, Oct. 1998, pp. 37-38.
Sato et al., “Hydrogen annealed silicon-on-insulator,” Appl. Phys. Lett. 65 (15): 1924-1926 (1994).
Peter Van Zant, Microchip Fabrication: A Practical Guide to Semiconductor Processing, Fourth Edition, McGraw-Hill, New York, pp. 63-64 (2000).
Aga Hiroji
Auberton-Herve André
Barge Thierry
Tate Naoto
Pizarro Marcos D.
S.O.O.Tec Silicon on Insulator Technologies
Winston & Strawn LLP
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