Process for treating metal surface

Details Process for treating metal surface Process for treating metal surface

1985-07-01

1987-02-17

Smith, John D.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

106 123, 427 98, 427437, 427409, 428901, H05K 346

Patent

active

046437932

ABSTRACT:
A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N.dbd. and --NH.sub.2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.

REFERENCES:
patent: 4301196 (1981-11-01), McCormick
patent: 4313995 (1982-02-01), Delgadillo
patent: 4388136 (1983-06-01), Huie
patent: 4548644 (1985-10-01), Nakaso

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