Process for treating copper surface

Details Process for treating copper surface Process for treating copper surface

1988-07-27

1990-02-20

Gallagher, John J.

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29852, 148269, 148272, 156151, 156253, 156281, 156314, 156630, 156902, 204 27, 204 381, 428901, B32B 310, B44C 122

Patent

active

049025511

ABSTRACT:
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.

REFERENCES:
patent: 3198672 (1965-08-01), Fehart
patent: 3551304 (1970-12-01), Letter et al.
patent: 4020225 (1977-04-01), Fujiwara
patent: 4409037 (1983-10-01), Landau
patent: 4642161 (1987-02-01), Akahoshi et al.

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