Process for treating copper alloys to improve thermal stability

Details Process for treating copper alloys to improve thermal stability Process for treating copper alloys to improve thermal stability

1976-06-28

1977-05-24

Stallard, W.

Metal treatment

Compositions

Heat treating

148 127C, C22F 108

Patent

active

040253678

ABSTRACT:
A process for improving the thermal stability of copper alloys having a low stacking fault energy is disclosed which comprises cold working the alloy, heating the alloy at a first temperature of from 100.degree. to 300.degree. C, additionally heating the alloy at a second temperature of from 200.degree. to 360.degree. C and cooling to room temperature. The second temperature must be higher than the first temperature.

REFERENCES:
patent: 3464865 (1969-09-01), Eichelman, Jr.
patent: 3475227 (1969-10-01), Caule et al.
patent: 3841921 (1974-10-01), Shapiro et al.
patent: 3852121 (1974-12-01), Crane et al.

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