Process for treating a semiconductor substrate comprising a surf

Details Process for treating a semiconductor substrate comprising a surf Process for treating a semiconductor substrate comprising a surf

1997-12-02

1999-11-23

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

438710, 438714, H01L 21302

Patent

active

059900130

ABSTRACT:
A process for treating a semiconductor substrate, comprising a prior surface-treatment step using a plasma at medium or low pressure, preferably having an electron concentration N.sub.e .gtoreq.10.sup.11 cm.sup.-3 and preferably producing a small potential difference V.sub.p -V.sub.f <20 V, wherein the surface energy of the treated surface is determined so as optionally to have fast feedback on the control of the process in order to optimize the plasma treatment, and the prior surface treatment step may be followed by a deposition step with a view to filling or planarizing the treated surface or to improving morphological, physical, or electrical characteristics of materials deposited on the treated surface.

REFERENCES:
patent: 4361033 (1982-11-01), Kim et al.
patent: 4855016 (1989-08-01), Jucha et al.
patent: 4937055 (1990-06-01), Kittler et al.
patent: 5266309 (1993-11-01), Gardella, Jr. et al.
patent: 5281546 (1994-01-01), Possin et al.
patent: 5723383 (1995-03-01), Kosugi et al.
Thin Solid Films, vol. 222, No. 1/02, Dec. 20, 1992, pp. 126-131, XP000345492 Ramm J. et al: Low-Temperature in Situ Claening of Silicon Wafers with an Ultra High Vacuum Compatible Plasma Source.
Journal of the Electrochemical Society, vol. 141, No. 11, Nov. 1, 1994, pp. 3136-3140, XP000493875 Carter R. J. et al.: "In Situ Remote H-Plasma Cleaning of Patterned SI-SI02 Surfvaces".

Affiliated with

Also associated with

Rating

Process for treating a semiconductor substrate comprising a surf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for treating a semiconductor substrate comprising a surf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for treating a semiconductor substrate comprising a surf will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1221505