Process for transferring a device to a substrate by viewing a re

Fishing – trapping – and vermin destroying

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437 8, 437906, 437974, H01L 3118, H01L 2166, H01L 2158

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054590817

ABSTRACT:
In a device fabrication method, there are prepared a first substrate having registration patterns formed thereon and a second substrate having through bores formed therein and devices formed thereon through a separation layer. The two substrates are overlapped by viewing the registration patterns through the through bores. After the first substrate and the devices formed on the second substrate have been bonded, the devices are separated from the second substrate by selectively etching the separation layer, and are transferred to the first substrate.

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"Pixels Consisting of a Single Vertical-Cavity Laser Thyristor and a Double Vertical-Cavity Phototransistor", Kosaka et al., IEEE Photonics Technology Letters, vol. 5, No. 12, Dec. 1993, pp. 1409-1411.
"Monolithic Integration of GaAs and In.sub.0.2 Ga.sub.0,8 As lasers by molecular beam epitaxy on GaAs", Appl. Phys. Lett. 58 (23), 10 Jun. 1991, pp. 2698-2700.

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