Process for tinning electrically conductive wire

Details Process for tinning electrically conductive wire Process for tinning electrically conductive wire

1991-05-08

1994-07-19

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427600, 427123, 427310, 427313, 427405, 427433, B05D 312, B05D 512, B05D 118, B05D 310

Patent

active

053308018

ABSTRACT:
A process for tinning plated wire involves first the placing of the wire in a suitable chemical flux for a period of time, the wire is then immersed for a period of time into a static solder pot having molten solder therein, the wire is then re-immersed into the chemical flux for a period of time, and finally the wire is immersed for a period of time into an ultrasonic solder pot having molten solder therein, the wire when removed from the ultrasonic pot being sufficiently tinned such that the solder has formed a suitable intermolecular bond to the plating in accordance with typical bonding criteria.

REFERENCES:
patent: 2007221 (1935-07-01), Smith
patent: 2824543 (1958-02-01), Brown
patent: 3912544 (1975-10-01), Sabatino
patent: 4307128 (1981-12-01), Nagano et al.
patent: 4709849 (1987-12-01), Socolowski
patent: 5075258 (1991-12-01), Carney et al.
Method 208E Solderability pp. 2630-2647, Apr. 1, 1980.

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