Process for throughplating printed circuit boards using conducti

Details Process for throughplating printed circuit boards using conducti Process for throughplating printed circuit boards using conducti

1997-03-28

1998-11-24

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427306, 427337, 427340, B05D 512

Patent

active

058403639

ABSTRACT:
The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.

REFERENCES:
patent: 4790912 (1988-12-01), Holtzman et al.
patent: 5183552 (1993-02-01), Bressel et al.
patent: 5194313 (1993-03-01), Hupe et al.
patent: 5223037 (1993-06-01), Kraiss et al.
patent: 5373629 (1994-12-01), Hupe et al.
Blasberg-Mitteilungen No. 11, Nov. 1991, "DMS 2, the break through".

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