Process for through-hole plating of two-layer circuit boards and

Details Process for through-hole plating of two-layer circuit boards and Process for through-hole plating of two-layer circuit boards and

1993-01-19

1995-04-04

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205185, 427 97, C25D 500, C25D 502, C25D 554

Patent

active

054034671

ABSTRACT:
A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.

REFERENCES:
patent: 5035926 (1991-07-01), Jonas et al.
Abstract of EP-A-0502023 (from "Orbit").

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