Process for three dimensional inspection of electronic component

Details Process for three dimensional inspection of electronic component Process for three dimensional inspection of electronic component

1999-05-28

2000-05-16

Mehta, Bhavesh

Image analysis

Applications

Manufacturing or product inspection

25055931, 382199, 348 95, 3562371, G06K 900

Patent

active

060647574

ABSTRACT:
A three dimensional inspection process for ball array devices. The ball array device is positioned in a fixed optical system. The ball array device is illuminated and a first image of the ball array device is taken with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second image of the ball array device is taken with a second camera disposed in a fixed focus position relative to the ball array device to obtain a top surface image of the ball. The first image and the second image are processed using a triangulation method to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.

REFERENCES:
patent: 4521807 (1985-06-01), Werson
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4731855 (1988-03-01), Suda et al.
patent: 5058178 (1991-10-01), Ray
patent: 5245671 (1993-09-01), Kobayashi et al.
patent: 5355221 (1994-10-01), Cohen et al.
patent: 5420689 (1995-05-01), Siu
patent: 5465152 (1995-11-01), Bilodeau et al.
patent: 5546189 (1996-08-01), Svetkoff et al.
patent: 5574668 (1996-11-01), Beaty
patent: 5574801 (1996-11-01), Collet-Beillon
patent: 5581632 (1996-12-01), Koljonen et al.
patent: 5592562 (1997-01-01), Rooks
patent: 5600150 (1997-02-01), Stern et al.
patent: 5617209 (1997-04-01), Svetkoff et al.
patent: 5621530 (1997-04-01), Marrable, Jr.
patent: 5648853 (1997-07-01), Stern et al.
patent: 5652658 (1997-07-01), Jackson et al.
patent: 5654800 (1997-08-01), Svetkoff et al.
patent: 5734475 (1998-03-01), Pai
patent: 5801966 (1998-09-01), Ohashi
patent: 5812268 (1998-09-01), Jackson et al.
patent: 5812269 (1998-09-01), Svetkoff et al.
patent: 5815275 (1998-09-01), Svetkoff et al.
patent: 5818061 (1998-10-01), Stern et al.
patent: 5828449 (1998-10-01), King et al.
patent: 5859698 (1999-07-01), Chau et al.
patent: 5859924 (1999-07-01), Liu et al.
patent: 5870489 (1999-02-01), Yamazaki et al.
patent: 5926557 (1999-07-01), King et al.
patent: 5943125 (1999-08-01), King et al.
ICOS Vision Systems Product literature on BGA 3D InspectionSystem.

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