Metal fusion bonding – Process – Plural heat applying
Patent
1992-07-14
1993-06-08
Seidel, Richard K.
Metal fusion bonding
Process
Plural heat applying
148516, 148521, 148665, 22826318, B23K 3102
Patent
active
052171582
ABSTRACT:
This invention relates to a process for thermodynamically treating a region joining two members. In accordance with one aspect of the present invention, are the steps of heating the region to a first temperature generally within a range of 750.degree. F. and 850.degree. F. so as to diffuse a strengthening material in the region into a heat affected zone between the members; maintaining the first temperature for a first selected time within a range of 3 to 20 hours so as to raise the percentage of strengthening material diffusing into the heat affected zone; heating the region to a second temperature generally within a range of 900.degree. F. to 1000.degree. F. so as to initiate hardening of the heat affected zone; maintaining the second temperature for a second selected time generally within a range of 0.5 to 5 hours so as to harden the heat affected zone with minimal decrease in hardening of regions outside the heat affected zone; and cooling the region to room temperature. This invention also relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified bead containing generally between 1.6 and 2.0% beryllium, a melt and mix zone containing generally between 0.6 and 1.8% beryllium, a recrystallized zone containing generally between 0.6 and 1.0% beryllium, and an overaged zone containing generally between 0.3 and 0.8% beryllium.
REFERENCES:
patent: 3865639 (1975-02-01), Bellot et al.
patent: 3997374 (1976-12-01), Dill et al.
patent: 4975128 (1990-12-01), Schmitz
Metals Handbook 9th Ed., vol. 4 "Heat Treating", pp. 728-734.
Lorenz Clarence S.
Ratka John O.
Spiegelberg William D.
Brush Wellman Inc.
Elpel Jeanne M.
Seidel Richard K.
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