Process for the wet-chemical treatment of disk-shaped workpieces

Details Process for the wet-chemical treatment of disk-shaped workpieces Process for the wet-chemical treatment of disk-shaped workpieces

1994-05-11

1995-09-19

Kastler, Scott

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 36, H01L 21306

Patent

active

054512670

ABSTRACT:
A process for the wet-chemical treatment of workpieces, especially of semiconductor wafers, includes exposing the workpieces to a flow of a gassified treatment medium generated by homogeneously dispersing gas bubbles in a liquid.

REFERENCES:
patent: 4687523 (1987-08-01), Hall et al.
patent: 4840701 (1989-06-01), Stern
patent: 4840701 (1989-06-01), Stern
patent: 5014727 (1991-05-01), Algo
patent: 5261966 (1993-11-01), Mashimo et al.
Patent Abstracts of Japan, JP57065325 Apr. 1982.
Patent Abstracts of Japan, 63-159640 Mar. 1990.
Patents Abstracts of Japan E-905 Mar. 19, 1990, vol. 14/No. 145 "Washing ice for Semiconductor Substrate with Water", NEC Kyush Ltd.
Patent Abstracts of Japan C-117, Aug. 3, 1982, vol. 6, No. 143.

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