Process for the treatment of copper oxide in the preparation of

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156278, 156901, 148 624, 427399, 427 96, 422 7, H05K 109, H05K 322, C23F 1100

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active

047174390

ABSTRACT:
A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.

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