Process for the synthesis of polyamides

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

528335, 528338, 528339, 528340, 528346, C08G 6926

Patent

active

054161894

ABSTRACT:
Process for the synthesis of polyamides by polycondensation in a closed reactor of one or a number of dicarboxylic acids with a diamine compound containing not less than 60 mol % of-m-xylyenediamine, in which all the amount of diamine compound stoichiometrically necessary for the polycondensation reaction is quickly brought into contact with the molten acid, the temperature of the reaction mixture is raised to a value greater than the melting point of the polyamide produced, the pressure is only allowed to rise to a value sufficient to prevent solidification of the reaction mixture and a substantial loss of diamine compound and, at the end of the reaction, the pressure of the reaction mixture is reduced and the polyamide formed is recovered.

REFERENCES:
patent: 2130947 (1938-09-01), Carothers
patent: 2130948 (1938-09-01), Carothers
patent: 2840547 (1958-06-01), Stump
C. E. Schildknecht et al., Polymerization Processes, pp. 444 to 446, vol. XXIX of the series "High Polymers", Wiley Interscience Publication 1977. month of publication is not available.
Patent Abstracts of Japan, vol. 010, No. 043 (C-329), Feb. 20th, 1986; & JP-A-60 190 425 (Furukawa), Sep. 27th, 1985.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for the synthesis of polyamides does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the synthesis of polyamides, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the synthesis of polyamides will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-638615

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.