Process for the solution of metals into an electrolytic...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating process fluid by means other than agitation or...

Reexamination Certificate

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C204S232000, C204S237000

Reexamination Certificate

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06921472

ABSTRACT:
A process for dissolving metals, in particular tin, and a plant for dissolving metals operating according to said process allow to minimize the quantity of metal in the sludge and the oxygen consumption, and entail a first step in which in a first reactor an effective quantity of oxygen is solubilized in an electrolytic solution obtaining an oxygen-enriched electrolytic solution; and a second step, distinct from the former, in which in a second reactor said oxygen-enriched solution is flown through a bed of metal for the deposition in a metallic form.

REFERENCES:
patent: 4789439 (1988-12-01), Bunk et al.
patent: 5082538 (1992-01-01), DeRespiris et al.
patent: 5312539 (1994-05-01), Thomson
Patent Abstracts of Japan, Pub. No. 03180492, Published Aug. 6, 1991, “Electroplating Method of Tin”, Inventor: Sugiyama Seiji Application No. 01320276.
Patent Abstracts of Japan, Pub. No. 07041999 Published, Feb. 10, 1995, “Preparation of Tin Electroplating Bath”, Inventor: Takahashi Koji Application No. 05183101.
Patent Abstracts of Japan, Pub. No. 53113728, Published Oct. 4, 1978, “Electro Tin Plating Method”, Inventor: Ikebe Masaru Application No. 52029090.
Patent Abstracts of Japan, Pub. No. 09031699, Published Feb. 4, 1997, “Electro Tin Plating Method Using Insoluble Anode”, Inventor: Mochizuki Kazuo Application No. 07186010.
Patent Abstracts of Japan, Pub. No. 53113729, Published Oct. 4, 1978, “Electro Tin Plating Method”, Inventor: Ikebe Masaru, Application No. 52029091.
Patent Abstracts of Japan, Pub. No. 06316795, Published Nov. 15, 1994, “Method and Device for Feeding Metal Ion into Plating Liquid”, Inventor: Sekida Takashi Application No. 05104132.
Patent Abstracts of Japan, Pub. No. 04314883, Published Nov. 6, 1992, “Tin Electroplating Method”, Inventor: Sugiyama Seji, Application No. 03108194.
Patent Abstracs of Japan Pub No. 09031698, Published Feb. 4, 1997, “Electro Tin Plating Method Using Insoluble Anode”, Inventor: Mochizuki Kazuo Application No. 07186009.
Derwent Publication “Tin Electroplating Process Tin Dissolve Oxygenate Solution Control Rate Produce Electrolytic”, Pub. No. JP53113729, Published Oct. 4, 1978.
Derwent Publication “Tin Electroplating Process Tin Dissolve Oxygenate Solution Control Rate Produce Electrolytic” Pub. No. JP53113728, Published Oct. 4, 1978.
Derwent Publication “Prevent Sludge Formation Electroplating Tin @ Comprise Blow Inert Gas Through Melt Bath Prevent Oxidation Tin Ion” Pub. No. JP431 4883, Published Nov. 6, 1992.

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