Process for the removal of CO.sub.2 and sulfur compounds from in

Gas separation: processes – Liquid contacting – And degasification of a liquid

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

95181, 95183, 95192, 95193, 95235, 95236, B01D 4706, B01D 5314

Patent

active

061029874

ABSTRACT:
A process for the removal of CO.sub.2 and sulfur compounds from natural gas and raw synthesis gas wherein N-formylmorpholine and N-acetylmorpholine mixtures are used as the desorbent at temperatures between -20.degree. C. and +40.degree. C. at pressures of 10 to 150 bar in a scrubbing operation. The acid gases are removed from the absorbent by flashing and the regenerated absorbent is recycled to the absorbent.

REFERENCES:
patent: 3362133 (1968-01-01), Kutsher et al.
patent: 3555782 (1971-01-01), Deringer
patent: 3760564 (1973-09-01), Alders et al.
patent: 3773896 (1973-11-01), Preusser
patent: 4050909 (1977-09-01), Ranke
patent: 4080424 (1978-03-01), Miller Loren et al.
patent: 4184855 (1980-01-01), Butwell et al.
patent: 4324567 (1982-04-01), Ranke et al.
patent: 4345918 (1982-08-01), Meissner Herman
patent: 4530704 (1985-07-01), Fowler Allan et al.
patent: 4545965 (1985-10-01), Gazzi Luigi et al.
patent: 4548620 (1985-10-01), Albiol
patent: 4556546 (1985-12-01), Burgoyne, Jr. et al.
patent: 4702898 (1987-10-01), Grover
patent: 4971607 (1990-11-01), Gazzi et al.
patent: 5797981 (1998-10-01), Collin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for the removal of CO.sub.2 and sulfur compounds from in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the removal of CO.sub.2 and sulfur compounds from in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the removal of CO.sub.2 and sulfur compounds from in will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2002289

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.