Process for the reduction of diene polymer hot melt adhesive col

Details Process for the reduction of diene polymer hot melt adhesive col Process for the reduction of diene polymer hot melt adhesive col

1993-11-05

1996-08-06

Jordan, Charles T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C08J 320, C08K 518

Patent

active

H00015814

ABSTRACT:
A method of reducing the color of a hot melt adhesive formulation comprising a coupled polymer of a conjugated diene which comprises adding to the formulation an amount of 4,4'-bis(alpha,alpha-dimethylbenzyl)diphenylamine sufficient to reduce color formation. This method is especially effective for epoxy resin coupled polymers and sequentially polymerized polymers.

REFERENCES:
patent: H1251 (1993-11-01), Southwick
patent: 3452056 (1969-06-01), Sundholm
patent: 4007230 (1977-01-01), Hinze
patent: 4117033 (1978-09-01), Gale
patent: 4125515 (1978-11-01), Kuczkowski
patent: 4277391 (1981-07-01), Charles
patent: 4837259 (1989-06-01), Chucta
patent: 4925889 (1990-05-01), Capolupo et al.
patent: 4954548 (1990-09-01), Klingensmith
patent: 5114998 (1992-05-01), Golder et al.
patent: 5145896 (1992-09-01), Southwick

Affiliated with

Also associated with

Rating

Process for the reduction of diene polymer hot melt adhesive col does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the reduction of diene polymer hot melt adhesive col, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the reduction of diene polymer hot melt adhesive col will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2182727