Process for the production of void-free prepreg sheets

Coating processes – With pretreatment of the base

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Details

156181, 427386, 4273898, 4274301, B05D 118, B05D 302, B32B 502, D04H 308

Patent

active

046908366

ABSTRACT:
A method is disclosed for the manufacture of void-free prepregs formed by the impregnation of a reinforcing cloth (e.g. glass fiber cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the method, the reinforcing cloth is first prewetted with a liquid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepregs are used in the manufacture of printed circuit boards.

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