Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1976-05-13
1977-09-13
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29580, 29591, 51319, B01J 1700
Patent
active
040472868
ABSTRACT:
A process for the production of semiconductor elements is set forth which includes metallizing a side of a large-area semiconductor wafer, having at least two zones of differing conductivity types, applying a soft-solder plate to the metallized side of said large-area wafer, bringing a perforated plate with a desired pattern of holes against said soft-solder plate, said perforated plate being formed of a material which does not form an alloy with said soft-solder plate, subjecting said perforated plate to a load while said soft-solder is heated to its melting temperature, cooling said soft-solder plate and removing it, and subjecting said large-area semiconductor wafer to a sand blast which is directed against the side coated with the solder metal until the large-area wafer has been divided up. The stream of the sand on the said blast may be as wide as the large-area wafer. The metal layer formed on the large-area wafer is preferably formed as two nickel layers and a gold layer.
REFERENCES:
patent: 3152939 (1964-10-01), Borneman
patent: 3389457 (1968-06-01), Goldman
patent: 3466510 (1969-09-01), Maute
patent: 3694972 (1972-10-01), Emeis
Lob Udo
Scheidel Fritz
Siemens Aktiengesellschaft
Tupman W.
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