Process for the production of semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S108000, C438S110000, C438S117000, C257S687000, C257S686000, C257S789000

Reexamination Certificate

active

06333206

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a process for the production of a semiconductor device which comprises mounting a semiconductor element on a mother board or daughter board in a face-down arrangement.
BACKGROUND OF THE INVENTION
As a demand accompanying the recent improvement of the properties of semiconductor devices there has been noted a process which comprises mounting a semiconductor element on a mother board or daughter board having a wiring circuit provided thereon in a face-down arrangement (e.g., flip-chip process, direct chip attach process). This is attributed to the fact that processes which have heretofore been used, such as a process which comprises bringing a semiconductor element into electrical contact with a lead frame with a gold wire to give a packaged form which is then mounted on a mother board or daughter board, are liable to delay in data transmission through wiring, error in data transmission due to crosstalk.
On the other hand, the foregoing flip-chip process and direct chip attach process are disadvantageous in that a semiconductor element and a mother or daughter board which have different linear expansion coefficient are brought into direct electrical connection with each other, reducing the reliability of the connection. As a countermeasure against this difficulty there has been taken an action which comprises injecting into the gap between the semiconductor element and the foregoing board a liquid resin material which is then hardened to form a hardened resin in which the stress concentrated at the electrical connection can be dispersed, enhancing the reliability of the connection. However, the foregoing liquid resin material needs to be stored at ultra low temperatures (−40° C.) as well as needs to be injected into the gap between the foregoing semiconductor element and board through a syringe. Thus, this action is disadvantageous in that the injection position and the amount of the resin to be injected can hardly be controlled. Further, since this action requires that the resin used normally stay liquid, it is difficult to use a solid resin material having a high reliability such as phenolic resin.
The present invention has been worked out under these circumstances. An object of the present invention is to provide a process for the production of a semiconductor device which can easily form an underfill resin layer in the gap between the foregoing semiconductor and board and facilitates the resin underfilling.
DISCLOSURE OF THE INVENTION
In order to accomplish the foregoing object of the present invention, the first aspect of the process for the production of a semiconductor device according to the present application comprises mounting a semiconductor element on a printed circuit board with a plurality of connecting electrode portions provided interposed therebetween, and then sealing the gap between the foregoing printed circuit board and semiconductor element with an underfill resin layer, characterized in that said underfill resin layer is formed by melting a lamellar solid resin provided interposed between the foregoing printed circuit board and semiconductor element.
In other words, the present invention comprises sealing with an underfill resin layer the gap between a printed circuit board and a semiconductor element which have been connected to each other with a plurality of connecting electrode portions provided interposed therebetween to produce a semiconductor device, characterized in that said sealing resin layer is formed by melting and hardening a lamellar solid resin provided interposed between the foregoing printed circuit board and semiconductor element. Thus, the connection between the foregoing printed circuit board and semiconductor element is completed while melting the foregoing lamellar solid resin, preferably under pressure. Accordingly, as compared with the conventional complicated process which comprises connecting a printed circuit board to a semiconductor element, and then injecting a sealing resin into the gap therebetween to complete the connection, the connection between the foregoing printed circuit board and semiconductor element and the sealing the gap therebetween with a resin can be effected at a time, drastically simplifying the production process. Further, since a solid resin having excellent storage properties is used as a sealing resin instead of liquid resin, the production process is not liable to the foregoing various problems caused by the injection of the liquid resin into the gap.
Further, the inventors found during their study of the invention the fact that the use of an epoxy resin composition comprising an inorganic filler having a maximum grain diameter of not more than 100 &mgr;m in a predetermined proportion as the foregoing solid resin makes it possible to fairly effect the packing of the gap between the foregoing circuit board and semiconductor element without forming any voids.
The underfill resin layer formed by melting the foregoing solid resin can be easily formed by, e.g., a process which comprises placing an underfill resin sheet (a kind of lamellar solid resin) on the foregoing printed circuit board, placing a semiconductor element on the underfill resin sheet, heating and melting the underfill resin sheet so that the underfill resin thus molten is packed into the gap between the printed circuit board and the semiconductor element, and then hardening the underfill resin.
In some detail, the underfill resin layer formed by melting the foregoing solid resin can be easily formed by a process which comprises forming an underfill resin layer in such an arrangement that the connecting electrode portions provided on the surface of the foregoing printed circuit board are each partly exposed, placing a semiconductor element on the foregoing printed circuit board in such an arrangement that the electrodes of the semiconductor element come in contact with the connecting electrode portions, heating and melting the foregoing underfill resin layer so that the underfill resin thus molten is packed into the gap between the printed circuit board and the semiconductor element, and then hardening the underfill resin. Alternatively, the underfill resin layer formed by melting the foregoing solid resin can be easily formed by a process which comprises forming an underfill resin layer in such an arrangement that the connecting electrode portions provided on the surface of the foregoing printed circuit board are each partly exposed, placing a semiconductor element on the foregoing printed circuit board in such an arrangement that the electrodes of the semiconductor element come in contact with the connecting electrode portions, heating and melting the foregoing underfill resin layer, preferably while the joint ball forming the electrode portions are being flattened under pressure or after they have been thus flattened, so that the underfill resin thus molten is packed into the gap between the printed circuit board and the semiconductor element, and then hardening the underfill resin.
In addition, the underfill resin layer formed by melting the foregoing solid resin can be easily formed by a process which comprises providing an underfill resin layer on one side of the foregoing semiconductor element, placing the semiconductor element on a printed circuit board having a plurality of connecting electrode portions provided thereon in such an arrangement that the underfill resin layer comes in contact with the connecting electrode portions, heating and melting the foregoing underfill resin layer so that the underfill resin thus molten is packed into the gap between the printed circuit board and the semiconductor element, and then hardening the underfill resin. Alternatively, the underfill resin layer formed by melting the foregoing solid resin can be easily formed by a process which comprises providing an underfill resin layer on one side of the foregoing printed circuit board, placing a semiconductor element having a plurality of connecting electrode portions provided thereon on the printe

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