Process for the production of printed circuit boards

Details Process for the production of printed circuit boards Process for the production of printed circuit boards

1987-04-22

1989-05-16

Beck, Shrive

Chemistry: electrical and wave energy

Processes and products

427 97, 4274431, 427 98, 427302, 427306, 427307, C25D 700

Patent

active

048307149

ABSTRACT:
An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

REFERENCES:
patent: 3501332 (1970-03-01), Buckman
patent: 4042387 (1977-08-01), Tarakci
patent: 4097286 (1978-06-01), Dafter, Jr.
patent: 4281034 (1981-07-01), Narayan
patent: 4285991 (1981-08-01), Gedrat
patent: 4493861 (1985-01-01), Sirinyan

Affiliated with

Also associated with

Rating

Process for the production of printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the production of printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the production of printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2320274