Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-05-29
2007-05-29
Wilezewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S031000, C438S042000
Reexamination Certificate
active
10735507
ABSTRACT:
A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
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Pinckney, L.R., “Ceramics and Glass”, Engineered Materials Handbook, vol. 4, ASM International, pp. 433-438.
Brunner Herbert
Jäger Harald
Cohen Pontani Lieberman & Pavane LLP
Osram Opto Semiconductor GmbH
Perkins Pamela E
Wilezewski M.
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