Process for the production of copper-clad laminate

Details Process for the production of copper-clad laminate Process for the production of copper-clad laminate

1993-05-05

1995-07-25

Johnstone, Adrienne

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562722, 1563077, 156320, B32B 3112, B32B 3118, B32B 3120, B32B 3122

Patent

active

054358779

ABSTRACT:
A process for the production of a copper-clad laminate which is improved in dimensional accuracy and freedom from bow and twist and shows nearly the same values of dimensional accuracy, thermal expansion coefficient and elastic modulus in the length and width directions, the process using:

REFERENCES:
patent: 3660199 (1972-05-01), Riccitiello et al.
patent: 4579612 (1986-04-01), Held
patent: 4956053 (1990-09-01), Polan et al.
patent: 5368674 (1994-11-01), Ishii et al.
Patent Abstracts of Japan, vol. 015, No. 008 (M-1067)9 Jan., 1991 & JP-A-02 258 337 (Sumitomo Bakelite Co., Ltd.) 19 Oct. 1990 *abstract*.
Patent Abstracts of Japan, vol. 015, No. 362 (M-1157)12 Sep. 1991 & JP-A-03 142 239 (Hitachi Chemical Co., Ltd.) 18 Jun. 1991 *abstract*.
Database WPI Week 9139, Derwent Publications Ltd., London, GB; An 91-286194 & JP-A-63 132 044 Shin Kolbe Elec Mach) 4 Jun. 1988 *abstract*.

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