Process for the production of circuit boards by a photo-etching

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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29625, 96 362, 156 3, 156 11, 156 16, 156 18, 427264, 427271, 427282, 427287, 427404, B05D 512

Patent

active

039912310

ABSTRACT:
A process or method for producing circuit boards by photo-etching characterized by exposing a first photo-sensitive layer applied to a conductive metal layer on the substrate, removing the unexposed portion of the photo-sensitive layer to expose portions of the metal conductive layer, applying a second metal layer of corrosion-resistant material on the exposed portions of the first metal layer, applying a second photo-sensitive layer, exposing the second photo-sensitive layer using the same mask with the width of the second unexposed pattern, which is an etch-resistant material, being greater than the width of the second metal layer, removing the exposed portions of the second photo-sensitive layer, and etching the first metal layer with a controlled under-etching of the second photo-sensitive layer up to the edges of the second metal layer and then removing the unexposed pattern of photo-sensitive material.

REFERENCES:
patent: 3666549 (1972-05-01), Rhodenizer et al.
patent: 3737314 (1973-06-01), Ruleff et al.
patent: 3775200 (1973-11-01), DE Nobel et al.

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