Process for the production of circuit board and the like

Details Process for the production of circuit board and the like Process for the production of circuit board and the like

1987-10-15

1989-03-14

Beck, Shrive

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

427 96, 427 98, 264129, 264135, B05C 3107

Patent

active

048123536

ABSTRACT:
A process for the production of a molded article such as a circuit board and the like includes applying catalyst such as palladium, gold, etc. to a primary molded article after roughening of its surfaces, then, after such pre-treatment, the primary molded article is set into a mold to form a secondary molded article covered with cover material only leaving a portion to be subjected to metal plating, and then the secondary molded article is removed from the mold and subjected to metal plating, and finally the cover material is removed after metal plating.

REFERENCES:
patent: 3884704 (1975-05-01), Rantell
patent: 4389771 (1983-06-01), Cassidy
patent: 4430154 (1984-02-01), Stahl
patent: 4451505 (1984-05-01), Jaus
patent: 4470883 (1984-09-01), Eichelberger
patent: 4532152 (1985-07-01), Elarde
patent: 4574031 (1986-03-01), Dorey

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