Process for the production of an epitaxially coated semiconducto

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from liquid or supercritical state – Having moving solid-liquid-solid region

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117 97, 117933, 117935, C30B 1310

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058977058

ABSTRACT:
A process for the production of an epitaxially coated semiconductor wafer, composed of a substrate wafer of monocrystalline silicon having a front side and a rear side, has at least one layer of semiconductor material which is epitaxially deposited on the front side of the substrate wafer and which is obtained by production of a heavily doped silicon monocrystal by crucible-free zone pulling, production of a substrate wafer having polished front side from the monocrystal and deposition of at least one epitaxial layer of semiconductor material on the front side of the substrate wafer.

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W. Dietze et al., Crystals, Growth, Properties and Applications, vol. 5, Springer-Verlag 1981, pp. 1-42.
Hiroshi Hirata and Naoshi Inoue, Japanese Journal of Applied Phys. vol. 24, No. 11, Nov. 1985, pp. 1399-1403 "Macroscopic Axial Dopant Distribution in Czochralski Silicon Crystals Grown in a Vertical Magnetic Field".
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