Process for the preparation of the modified resin and epoxy resi

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525105, 525119, 525122, 525476, C08L 8306

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active

051090678

ABSTRACT:
A process for preparing a modified resin and an epoxy resin composition for use in semiconductor encapsulation which comprises providing a quantity of epoxy resins, synthetic rubber compounds, and hydroxy modified polysiloxanes, reacting the epoxy resins with the synthetic rubber compounds, and reacting the resultant product of the initial reaction with the hydroxy modified polysiloxanes, the epoxy resin composition comprising 0.1-10% by weight of the modified resin, epoxy resin, curing agent, catalyst, releasing agent, coupling agent, and fibers.

REFERENCES:
patent: 3179143 (1965-04-01), Schultz et al.
patent: 3926904 (1975-12-01), Scola
patent: 3959533 (1976-05-01), Kitaj
patent: 4234702 (1980-11-01), Nakamura
patent: 4275190 (1981-06-01), Dudgeon
patent: 4657986 (1987-04-01), Isayama et al.

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