Process for the preparation of phenolic resin-containing dispers

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156335, 428524, 524510, 524541, 524841, 524843, 525134, 525502, C09J 502

Patent

active

044002297

ABSTRACT:
Aqueous dispersions of a phenolic resole and a thermoplastics polymeric material or a rubber, suitable for use as adhesives, are prepared by
(a) dissolving a solid thermoplastics polymeric material, such as a polyvinyl acetal or a nylon polyamide, or rubber in a phenol,
(b) adding a nonionic or anionic surface active agent and/or protective colloid,
(c) adjusting the mixture to a pH above 7 by addition of a base,
(d) adding aqueous formaldehyde solution, or a formaldehyde donor, to a molar ratio of phenol to formaldehyde within the range 1:1 to 1:3,
(e) if necessary, adding water, and
(f) heating the mixture to form a phenolic resole.

REFERENCES:
patent: 2128635 (1938-08-01), Charch et al.
patent: 2748046 (1956-05-01), Works et al.
patent: 3259670 (1966-07-01), Weltman et al.
patent: 3634307 (1972-01-01), Morton
patent: 3657177 (1972-04-01), Adesko
patent: 3870670 (1975-03-01), Hofel et al.
CA, 87, 136980y, (1977).
Derwent, 54622W/33, 71445W/43, 14652A/08, 18805W/11.

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