Process for the preparation of high molecular thermoplastic epox

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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528111, 528116, 528121, 528122, 528124, 528407, C08G 5950, C08G 6526

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043080855

ABSTRACT:
High molecular linear, thermoplastic, epoxide-amine-adducts containing the structural segment ##STR1## are prepared by a solvent-free reaction of equivalent amounts at 20 to 200.degree. C. of N,N'-bis(aralkyl) diamines (for example, N,N'-dibenzyl-ethylenediamine, N,N'-dibenzyl-p-xylylenediamine, N,N'-dibenzyl-4,4'-diamino-diphenylmethane, N,N'-dibenzyl-3,6-dioxa-octanediamine-1,8) with diepoxides (for example, 2,2-bis(4-glycidyloxyphenyl)propane). The polyadducts are soluble and may be processed by thermoplastic methods. The polyaddition process may be conducted for the forming of shaped objects in a form-shaping vessel, for the production of coatings directly upon the surface to be coated and also in the presence of inserted materials and has, due to these characteristics, the nature of a casting system.

REFERENCES:
patent: 3317471 (1967-05-01), Johnson et al.
patent: 3554956 (1971-01-01), Jones
patent: 3580887 (1971-05-01), Hubin
patent: 3592946 (1971-07-01), Griffith

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