Process for the preparation of flexible circuits

Details Process for the preparation of flexible circuits Process for the preparation of flexible circuits

1983-07-05

1984-07-17

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156227, 1562733, 156297, 156302, 156322, 156324, 430291, 430311, 430328, 430330, 430319, 427 98, B32B 3100, B65C 3100

Patent

active

044604270

ABSTRACT:
Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises

REFERENCES:
patent: 2760863 (1956-08-01), Plambeck
patent: 2850445 (1958-09-01), Oster
patent: 2875047 (1959-02-01), Oster
patent: 2927022 (1960-03-01), Martin et al.
patent: 3060024 (1962-10-01), Burg et al.
patent: 3074974 (1963-01-01), Gebura
patent: 3095309 (1963-06-01), Zeblisky et al.
patent: 3097096 (1963-07-01), Oster
patent: 3097097 (1963-07-01), Oster et al.
patent: 3145104 (1964-08-01), Oster et al.
patent: 3391455 (1968-07-01), Hirohata et al.
patent: 3427161 (1969-02-01), Laridon et al.
patent: 3479185 (1969-11-01), Chamberg
patent: 3506483 (1970-04-01), Flook
patent: 3549367 (1970-12-01), Chang et al.
patent: 3637385 (1972-01-01), Hayes et al.
patent: 3649268 (1972-03-01), Chu et al.
patent: 4019821 (1977-04-01), Sandner
patent: 4054479 (1977-10-01), Peiffer
patent: 4054483 (1977-10-01), Peiffer
patent: 4137116 (1979-01-01), Miller
patent: 4234626 (1980-11-01), Peiffer
patent: 4239849 (1980-12-01), Lipson et al.
patent: 4293635 (1981-10-01), Flint et al.
patent: 4310365 (1982-01-01), Elliott et al.
patent: 4370182 (1983-01-01), Becker et al.
patent: 4378264 (1983-03-01), Pilette et al.
patent: 4405394 (1983-09-01), Cohen

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