Chemistry of inorganic compounds – Oxygen or compound thereof – Metal containing
Patent
1984-06-01
1985-11-26
Carter, Herbert T.
Chemistry of inorganic compounds
Oxygen or compound thereof
Metal containing
423628, 423629, 423630, 423631, C01F 702, C01F 734
Patent
active
045553947
ABSTRACT:
An improved process for the preparation of alumina, including forming an alumina hydrogel from aluminum hydroxide, and processing the alumina hydrogel into alumina. The improvement involves the alumina hydrogel forming step which is connected in the presence of sulfate ion and which comprises providing, in a reaction zone, an aqueous slurry containing seed aluminum hydroxide and having a pH of 6-11, and feeding to the reaction zone an aluminum compound and a pH controlling agent for mixing with the aqueous slurry while maintaining the aqueous slurry at a temperature of at least about 50.degree. C. at feed rates so that the pH of the aqueous slurry is maintained within the range of 6-11 and that 0.2-5 mols/hour of aluminum components, in terms of elemental aluminum, are fed to the reaction zone per mole of the seed aluminum hydroxide originally contained in the aqueous slurry, whereby the seed aluminum hydroxide is caused to grow to the aluminum hydrogel.
REFERENCES:
patent: 3649184 (1972-03-01), Featherston
patent: 4313923 (1982-02-01), Block et al.
patent: 4364919 (1982-12-01), Yamada et al.
patent: 4371513 (1983-02-01), Sanchez et al.
Brace et al, Aluminum Hydrous Oxide Sols-I, Journal of Inorganic and Nuclear Chemistry, vol. 35, p. 3691, (1973).
Asaoka Sachio
Sendo Takashi
Carter Herbert T.
Chiyoda Chemical Engineering & Construction Co. Ltd.
LandOfFree
Process for the preparation of alumina does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the preparation of alumina, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the preparation of alumina will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-269214