Process for the preparation of a target component for cathode sp

Details Process for the preparation of a target component for cathode sp Process for the preparation of a target component for cathode sp

1994-07-26

1996-04-16

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

20429812, 20429813, 427193, 4271266, 4273762, 427226, 264 60, 264 66, 264 67, C04B 3700, C04B 3571, B05D 302

Patent

active

055078974

ABSTRACT:
A target element is formed by creating a precursor system which may yield an inorganic material at a temperature of 300-1600 C. which is lower than the melting point of said material. The precursor system contains an inorganic additive having a melting point no higher than. The precursor system is applied to a support other than a foam or metal felt, the resulting assembly is heated to said temperature and this temperature is maintained for a sufficient time to produce said inorganic material, whereafter the assembly formed by the inorganic material and the support is gradually cooled to room temperature. To produce the target, the target element (2) is bonded to a metal substrate (4) by means of a layer (3) of conductive adhesive.

REFERENCES:
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4421628 (1983-12-01), Quaderer
patent: 4962071 (1990-10-01), Bayard
patent: 5071800 (1991-12-01), Iwamoto et al.
patent: 5086351 (1992-02-01), Couput et al.
patent: 5091221 (1992-02-01), Chu et al.
patent: 5160675 (1992-11-01), Iwamoto et al.
patent: 5244556 (1993-09-01), Inoue

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